Effects of plasma treatment on the peel strength of Ni on polyimide

Electronic Materials Letters

Volumn 8, Issue 2, 2012, Pages 151-156

  Woo, Tae Gyu ^a   Park, Il Song ^a   Jung, Kwang Hee ^a   Jeon, Woo Yong ^b   Hwang, Young Kyu ^c   Seol, Kyeong Won ^a  

^a Chonbuk National University   (South Korea)

^b KwangYang Health College   (South Korea)

^c Calix Electronic chemical Co Ltd   (South Korea)

Author keywords

electrodeposited copper foils; flexible printed circuit; peel strength; plasma treatment

Indexed keywords

CHEMICAL BINDING; CU LAYERS; DEPOSITION LAYERS; ELECTRODEPOSITED COPPER; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FLEXIBLE COPPER CLAD LAMINATE; FLEXIBLE PRINTED CIRCUIT; MECHANICAL BINDING; MICROELECTRONICS PACKAGING; PEEL STRENGTH; PLASMA TREATMENT; PRE-TREATMENT; SURFACE ETCHING; SURFACE SHAPE;

COPPER METALLOGRAPHY; DISSIMILAR MATERIALS; FIELD EMISSION MICROSCOPES; INTERFACES (MATERIALS); MICROELECTRONICS; PHOTOELECTRONS; PLASMA APPLICATIONS; POLYIMIDES; SURFACE MORPHOLOGY; SURFACE ROUGHNESS; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

CRYSTAL STRUCTURE;

EID: 84860536764     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-012-1075-5     Document Type: Article

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