New plating bath for electroless copper deposition on sputtered barrier layers

Microelectronic Engineering

Volumn 50, Issue 1-4, 2000, Pages 441-447

  Lantasov, Yuri ^a   Palmans, Roger ^a   Maex, Karen ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; COPPER PLATING; DEPOSITION; DIFFUSION IN SOLIDS; ELECTROLESS PLATING; METALLIC FILMS; MORPHOLOGY;

ELECTROLESS COPPER DEPOSITION; PLATING BATH;

INTERCONNECTION NETWORKS;

EID: 0033639735     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00313-5     Document Type: Article

References (4)

1. Murarka S.P. Multilevel interconnections for ULSI and GSI era. Mater. Sci. Eng. R19:(3-4):1997;87-151.
2. W.S. Min, Y. Lantasov, R. Palmans, K. Maex, D.N. Lee, The formation of Pd seeded copper layer on TiN substrates by electroless deposition, in: G. Sandhu, H. Koerner, M. Murakami, Y. Yasuda, N. Kobayashi (Eds.), Proc. Advanced Metallization Conference, Colorado Springs, 1998, pp. 65-71.
3. Palmans R., Maex K. Development of an electroless copper deposition bath for via fill applications on TiN seed layers. Blumenthal R., Janssen G. Advanced Metallization for ULSI Applications in 1994. 1995;87-94 Materials Research Society, Pittsburgh.
4. Awaya N., Kobayashi T. Effect of thin-film texture and zirconium diffusion on reliability against electromigration in chemical-vapor-deposited copper interconnects. Jpn. J. Appl. Phys. Part 1. 3B:1998;1156-1161.