Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders

Journal of Alloys and Compounds

Volumn 567, Issue , 2013, Pages 10-14

  Lee, Ji Hyun ^a   Kim, Young Min ^a   Hwang, Ji Hwan ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Cu Zn layer; Cyanide free; Flux type; Sn Ag Cu solder; Wetting test

Indexed keywords

CU-ZN LAYER; CYANIDE-FREE; REFLOW TEMPERATURES; SN-3.0AG-0.5CU SOLDERS; SNAGCU SOLDER; SOLDERING TEMPERATURE; WETTING CHARACTERISTICS; WETTING TESTS;

CYANIDES; ELECTROPLATING; LEAD; SILVER; SOLDERING; SOLDERING ALLOYS; TIN; ZINC;

WETTING;

EID: 84875947059     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.03.083     Document Type: Article

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