Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni

Materials and Design

Volumn 50, Issue , 2013, Pages 108-116

  Hammad, A E ^a  

^a Zagazig University   (Egypt)

Author keywords

Hardness; Intermetallic compound; Lead free solders; Microstructure; Tensile

Indexed keywords

ACTIVATION ENERGY; HARDNESS; INTERMETALLICS; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; NICKEL; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; TENSILE STRENGTH; TIN ALLOYS;

DOMINANT DEFORMATION MECHANISM; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MICROSTRUCTURAL REFINEMENT; MICROSTRUCTURE AND MECHANICAL PROPERTIES; TEMPERATURE DEPENDENCE; TENSILE; UNIFORM DISTRIBUTION;

TIN;

EID: 84875767866     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2013.03.010     Document Type: Article

References (27)

1. El-Daly A.A., Hammad A.E. Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and In. J Alloy Compd 2011, 509:8554-8560.
2. Kotadia H.R., Mokhtari O., Clode M.P., Green M.A., Mannan S.H. Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates. J Alloy Compd 2012, 511:176-188.
3. 2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder. Mater Des 2011, 32:4720-4727.
4. El-Daly A.A., Fawzy A., Mohamad A.Z., El-Taher A.M. Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and Cu. J Alloy Compd 2011, 509:4574-4582.
5. Zhang L., Xue S.B., Zeng G., Gao L.L., Ye H. Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J Alloy Compd 2012, 510:38-45.
6. 3Sn at Sn-3.0Ag-0.3Cu-0.05Cr/Cu joint interfaces during thermal aging. J Alloy Compd 2011, 509:6666-6672.
7. Che F.X., Zhu W.H., Poh Edith S.W., Zhang X.W., Zhang X.R. The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures. J Alloy Compd 2010, 507:215-224.
8. Kittidacha W, Kanjanavikat A, Vattananiyom K. Effect of SAC alloy composition on drop and temp cycle reliability of BGA with NiAu pad finish. In: Proc 10th IEEE-EPTC conf; 2008. p. 1074-79.
9. Shnawah D.A.A., Said S.B.M., Sabri M.F.M., Badruddin I.A., Che F.X. Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. Microelectron Reliab 2012, 52:2701-2708.
10. Su Y.A., Tan L.B., Tee T.Y., Tan V.B.C. Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectron Reliab 2010, 50:564-576.
11. Cheng F., Nishikawa H., Takemoto T. Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co. J Mater Sci 2008, 43:3643-3648.
12. Yoon J.W., Noh B.I., Jung S.B. Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints. J Alloy Compd 2010, 506:331-337.
13. Dong W., Shi Y., Lei Y., Xia Z., Guo F. Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. J Mater Sci Mater Electron 2009, 20:1008-1017.
14. Hodúlová E., Palcut M., Lechovič E., Šimeková B., Ulrich K. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X=Bi, In) solders with Cu substrate. J Alloy Compd 2011, 509:7052-7059.
15. Song H.Y., Zhu Q.S., Wang Z.G., Shang J.K., Lu M. Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy. Mater Sci Eng A 2010, 527:1343-1350.
16. Gao L., Xue S., Zhang L., Sheng Z., Ji F., Dai W., et al. Effect of alloying elements on properties and microstructures of SnAgCu solders. Microelectron Eng 2010, 87:2025-2034.
17. Kanlayasiri K., Mongkolwongrojn M., Ariga T. Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy. J Alloy Compd 2009, 485:225-230.
18. El-Daly A.A., Hammad A.E. Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions. Mater Des 2012, 40:292-298.
19. Suh D., Kim D.W., Liu P., Kim H., Weninger J.A., Kumar C.M., et al. Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high strain rate conditions. Mater Sci Eng A 2007, 460-461:595-603.
20. Kim K.S., Huh S.H., Suganuma K. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Microelectron Reliab 2003, 43:259-267.
21. Montesperelli G., Rapone M., Nanni F., Travaglia P., Riani P., Marazza R., et al. Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders. Mater Corrosion 2008, 59:662-669.
22. Ventura T., Gourlay C.M., Nogita K., Nishimura T., Rappaz M., Dahle A.K. The influence of 0-0.1wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Electron Mater 2008, 37:32-39.
23. 2 composite solder on flexible ball grid array substrates. Microelectron Reliab 2011, 51:975-984.
24. Zhang J., Chen B., Zhang B. Effect of initial microstructure on the hot compression deformation behavior of a 2219 aluminum alloy. Mater Des 2012, 34:15-21.
25. El-Daly A.A., Hammad A.E., Fawzy A., Nasrallh D.A. Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions. Mater Des 2013, 43:40-49.
26. Hidaka N., Watanabe H., Yoshiba M. Creep behavior of lead-free Sn-Ag-Cu+Ni-Ge solder alloys. J Electron Mater 2009, 38:670-677.
27. Shohji I., Yoshida T., Takahashi T., Hioki S. Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity. Mater Sci Eng A 2004, 366:50-55.