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Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 6, 2013, Pages 1748-1757

Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder

(3) Kumar, Santosh a Jung, Dohyun a Jung, Jaepil a

a University of Seoul (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC PROPERTIES; ELECTRONIC DEVICE; MICROELECTRONICS PACKAGING; NANOINDENTATION TECHNIQUES; PARTICLE COUNTING; SOLID SOLUTION HARDENING; TRACE IMPURITIES; ULTRA LOW BACKGROUNDS;

ALPHA PARTICLES; ELASTIC MODULI; ELASTICITY; HARDNESS; MICROELECTRONICS; NANOINDENTATION; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; VICKERS HARDNESS TESTING; WETTING;

TIN;

EID: 84878735106 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-012-1006-0 Document Type: Article

Times cited : (9)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.