Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys

Materials Science and Engineering: A

Volumn 532, Issue , 2012, Pages 212-220

  Witkin, David B ^a  

^a AEROSPACE CORPORATION   (United States)

Author keywords

Aging; Dynamic mechanical analysis; Lead free solder alloys; Mechanical properties

Indexed keywords

BINARY ALLOYS; BISMUTH ALLOYS; COPPER ALLOYS; DAMPING; DYNAMIC MECHANICAL ANALYSIS; DYNAMICS; EUTECTICS; LEAD ALLOYS; LEAD-FREE SOLDERS; LINEAR TRANSFORMATIONS; TENSILE STRENGTH; TENSILE TESTING; TERNARY ALLOYS; TIN ALLOYS;

% REDUCTIONS; AS-CAST; CIRCUIT BOARDS; CONDITION; LEAD-FREE SOLDER ALLOY; PB-FREE SOLDER ALLOYS; QUASI-DYNAMICS; QUASI-STATIC; RELIABILITY PERFORMANCE; STATIC AND DYNAMIC MECHANICAL PROPERTIES;

SILVER ALLOYS;

EID: 83855164006     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.10.082     Document Type: Article

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