Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Soldering and Surface Mount Technology

Volumn 22, Issue 4, 2010, Pages 57-64

  Zeng, Guang ^a   Xue, Songbai ^a   Zhang, Liang ^a   Sheng, Zhong ^a   Gao, Lili ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Alloys; Creep; Finite element analysis; Mechanical behaviour of materials; Metals; Solder

Indexed keywords

CREEP TESTS; DESIGN/METHODOLOGY/APPROACH; EXPERIMENTAL PROCEDURE; FINE PITCH; FINITE ELEMENT ANALYSIS; FINITE ELEMENT SIMULATIONS; INDUSTRY APPLICATIONS; INTERMETALLIC COMPOUND LAYER; LEAD-FREE SOLDER JOINT; MECHANICAL BEHAVIOUR; MICRO-STRUCTURAL; MICROSTRUCTURE REFINEMENT; QUAD FLAT PACKAGE; RELIABILITY EVALUATION; SIMULATION RESULT; SNAGCU SOLDER; SOLDER; SOLDER ALLOYS; SOLDER JOINTS; THERMAL FATIGUE PROPERTIES; TRACE AMOUNTS;

CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; CREEP; CREEP RESISTANCE; ELECTRONICS INDUSTRY; EXPERIMENTS; FINITE ELEMENT METHOD; INTERMETALLICS; MECHANICAL ENGINEERING; MECHANICAL PROPERTIES; METAL ANALYSIS; MICROSTRUCTURE; QUALITY ASSURANCE; RELIABILITY; THERMAL FATIGUE; TRACE ELEMENTS;

SOLDERING ALLOYS;

EID: 77957597232     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911011076899     Document Type: Article

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