Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers

Handbook of Wafer Bonding

Volumn , Issue , 2012, Pages 161-180

  Chen, Kuan Neng ^a   Tan, Chuan Seng ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Copper; Cu; Thermocompression; Wafer bonding

Indexed keywords

EID: 84883437997     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9783527644223.ch9     Document Type: Chapter

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