All-copper chip-to-substrate interconnects: Bonding, testing, and design for electrical performance and thermo-mechanical reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 67-74

  Osborn, Tyler ^a   He, Ate ^a   Lightsey, Hunter ^a   Kohl, Paul ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PILLARS; ELECTRICAL PERFORMANCES; MECHANICAL COMPLIANCE;

ABS RESINS; ANNEALING; BOND STRENGTH (MATERIALS); COMPUTER NETWORKS; COPPER PLATING; ELECTROLESS PLATING; ELECTROPLATING; SILICON; STRENGTH OF MATERIALS; SUBSTRATES;

COPPER;

EID: 51349150007     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549952     Document Type: Conference Paper

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