Room temperature Cu-Cu direct bonding using surface activated bonding method

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 21, Issue 2, 2003, Pages 449-453

  Kim, T H ^a   Howlader, M M R ^a   Itoh, T ^a   Suga, T ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; DIFFUSION; ION BEAMS; ION BOMBARDMENT; SILICON WAFERS; SURFACE ROUGHNESS; TENSILE TESTING; THIN FILMS; ULTRAHIGH VACUUM;

BONDING STRENGTH;

BONDING;

EID: 0037350078     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1537716     Document Type: Article

References (21)

1. J. B. Lasky, Appl. Phys. Lett. 48, 78 (1986).
2. S. Bengtsson, J. Electron. Mater. 21, 841 (1992).
3. O. Zucker, W. Langheinrich, and M. Kulozik, Sens. Actuators A 36, 227 (1992).
4. K. L. Enisherlova, T. F. Rusak, E. N. Chrvyakova, and R. N. Vinogradov, Mater. Sci. Eng., B 46, 33 (1997).
5. D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi, and K. Jayakar, J. Micromech. Microeng. 11, 630 (2001).
6. P. L. Pai and C. H. Ting, IEEE Electron Device Lett. 10, 423 (1989).
7. T. Nitta, T. Ohmi, T. Hoshi, S. Sakai, K. Sakaibara, S. Imai, and T. Shibata, J. Electrochem. Soc. 140, 1131 (1993).
8. K. C. Saraswat and F. Mohammadi, IEEE Trans. Electron Devices ED-29, 645 (1982).
9. M. T. Bohr and Y. A. El-Mansy, IEEE Trans. Electron Devices 45, 620 (1998).
10. Y. Morand, Microelectron. Eng. 50, 391 (2000).
11. S. P. Murarka and S. W. Hynes, Solid State Mater. Sci. 20, 87 (1995).
12. A. Fan, A. Rahman, and R. Reif, Electrochem, Solid-State Lett. 2, 534 (1999).
13. K. N. Chen, A. Fan, and R. Reif, J. Electron. Mater. 30, 331 (2001).
14. Y. A. Li, R. W. Bower, and I. Bencuya, Jpn. J. Appl. Phys., Part 1 37, 1068 (1998).
15. H. Takagi, K. Kikuchi, T. R. Chung, and T. Suga, Appl. Phys. Lett. 68, 2222 (1996).
16. H. Takagi, R. Maeda, T. R. N. Hosoda, and T. Suga, Jpn. J. Appl. Phys., Part 1 3, 1589 (1999).
17. H. R. Kaufman, J. Vac. Sci. Technol. A 5, 2081 (1987).
18. T. Suga, M. M. R. Howlader, T. Itoh, C. Inaka, Y. Arai, and A. Yamaguchi, 51st Electronics Computer, and Technology Conference, FL, 2001, p. 556.
19. J. M. E. Harper and J. J. Cuomo, J. Vac. Sci. Technol. A 3, 2693 (1985).
20. T. M. Mayer, J. M. E. Harper, and J. J. Cuomo, J. Vac. Sci. Technol. A 3, 1779 (1985).
21. Q.-Y. Tong and U. Gosele, Semiconductor Wafer Bonding (Wiley, New York, 1999), p. 79.