Technology and applications of three-dimensional integration

Proceedings - Electrochemical Society

Volumn 4, Issue , 2004, Pages 261-276

  Reif, Rafael ^a   Seng Tan, Chuan ^a   Fan, Andy ^a   Chen, Kuan Neng ^a   Das, Shamik ^a   Checka, Nisha ^a  

^a Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON ETCHING; SILICON LAYER TRANSFER PROCESSES; SYSTEM-ON-A-CHIP (SOC); WAFER DE-BONDING;

BONDING; COMPUTER AIDED DESIGN; CRYSTALLIZATION; ETCHING; INTEGRATING CIRCUITS; LARGE SCALE SYSTEMS; LOGIC DESIGN; LOW TEMPERATURE EFFECTS; METALLIZING; SILICA;

INTEGRATED CIRCUITS;

EID: 17044371266     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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