3D integration using adhesive, metal, and metal/adhesive as wafer bonding interfaces

Materials Research Society Symposium Proceedings

Volumn 1112, Issue , 2009, Pages 69-80

  Lu, Jian Qiang ^a   McMahon, J Jay ^a,b   Gutmann, Ronald J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BONDING INTERFACES; EMERGING TECHNOLOGIES; FUNCTIONAL COMPONENTS; HIGHLY INTEGRATED; MULTIPLE MATERIALS; SIMILARITIES AND DIFFERENCES; THREE DIMENSIONAL (3D) INTEGRATION;

MATERIALS; TECHNOLOGY; THREE DIMENSIONAL;

WAFER BONDING;

EID: 70449581032     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (28)

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