A comparative study of the bonding energy in adhesive wafer bonding

Journal of Micromechanics and Microengineering

Volumn 23, Issue 8, 2013, Pages

  Forsberg, F ^a   Saharil, F ^a   Haraldsson, T ^a   Roxhed, N ^a   Stemme, G ^a   Van Der Wijngaart, W ^a   Niklaus, F ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION ENERGY; ADHESION PROMOTER; ADHESIVE WAFER BONDING; BENZOCYCLOBUTENE; BONDING ENERGIES; CIRCULAR CAVITY; COMPARATIVE STUDIES; CRITICAL PRESSURES;

ADHESION; DELAMINATION; POLYMERS; SILICON; WAFER BONDING;

SILICON WAFERS;

EID: 84881171360     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/8/085019     Document Type: Article

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