Adhesive bonding with SU-8 at wafer level for microfluidic devices

Journal of Physics: Conference Series

Volumn 34, Issue 1, 2006, Pages 776-781

  Yu, Liming ^a,b   Tay, Francis E H ^a,b   Xu, Guolin ^a   Chen, Bangtao ^a   Avram, Marioara ^c   Iliescu, Ciprian ^a  

^a INSTITUTE OF BIOENGINEERING AND NANOTECHNOLOGY   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^c NATIONAL INSTITUTE FOR RESEARCH AND DEVELOPMENT IN MICROTECHNOLOGIES   (Romania)

Author keywords

Adhesive bonding; Contact imprinting; SU 8 photoresist; Wafer to wafer bonding

Indexed keywords

EID: 33744523267     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/34/1/128     Document Type: Article

References (9)

1. Tong Q-Y, U Goesele 1999 Semiconductor wafer bonding (John Wiley and Sons)
2. Hiller K Application of low temperature direct bonding in optical devices and integrated systems Proc. of Microsystem Technology (Munich, Germany, October) p 102-109
3. Younger P R 1980 Hermetic glass sealing by electrostatic Bonding J. Non-Crystalline Solids 38/39 909
4. Lin L, Y-T, Cheng, K Najafi 1998 Formation of silicon-gold eutectic bond using localized heating method Japan. J. Appl. Phys. 37 L1412-L1414
5. Wiemer M, J Frömel, C Jia, T Gessner 2003 Bonding and contacting of MEMS-structures on wafer level The Electrochemical Society- 203rd Meeting (Paris, France, April-May) p 58-60
6. Reuter D S, G Schwenzer, A Bertz, T Gessner 2004 Selective adhesive bonding with SU-8 for zero-level-packaging Proc. SPIE 5650 163-171
7. Niklaus F, P Enoksson, E Kalvesten, G Stemme 2001 Low-temperature full wafer adhesive bonding J. Micromech. Microeng. 11 100-107
8. Oberhammer J, F Niklaus, G Stemme 2003 Selective wafer-level adhesive bonding with bezocyclobutene for fabrication of cavities Sensors Actuators A 105/3 297-304
9. Iliescu C, G L Xu, V Samper, F E H Tay 2005 Fabrication of a dielectrophoretic chip with 3D silicon electrodes J. Micromech. Microeng. 15 494-500