Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2013, Pages 343-346

  Forsberg, Fredrik ^a   Saharil, Farizah ^a   Stemme, Göran ^a   Roxhed, Niclas ^a   Van Der Wijngaart, Wouter ^a   Haraldsson, Tommy ^a   Niklaus, Frank ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE WAFER BONDING; BOND ENERGIES; DUAL CURE SYSTEMS; HIGH-QUALITY MATERIALS; LOW-TEMPERATURE ADHESIVES; NANO-IMPRINT; OXYGEN PLASMAS; THERMAL CURES;

CURING; INTERFACES (MATERIALS); STOICHIOMETRY; THREE DIMENSIONAL COMPUTER GRAPHICS; WAFER BONDING;

MEMS;

EID: 84875443694     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2013.6474248     Document Type: Conference Paper

References (9)

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