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Journal of Micromechanics and Microengineering

Volumn 2, Issue 3, 1992, Pages 113-116

Silicon fusion bonding and its characterization

(4) Harendt, C a Graf, H G a Hofflinger, B a Penteker, E a

a Institut fur Mikroelektronik Stuttgart (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BOND QUALITY; ROOM TEMPERATURE MATING; SILICON FUSION BONDING; WAFER FUSION BONDING;

ANNEALING; HEAT TREATMENT; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; SILICON; SILICON NITRIDE;

BONDING;

EID: 0026912077 PISSN: 09601317 EISSN: None Source Type: Journal
DOI: 10.1088/0960-1317/2/3/001 Document Type: Review

Times cited : (60)

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