SCOPUS 정보 검색 플랫폼

Volumn 580, Issue , 2013, Pages 162-171

Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis

(4) Hu, Xiao a Chan, Y C a Zhang, Kaili a Yung, K C b

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

b HONG KONG POLYTECHNIC UNIVERSITY (Hong Kong)

Author keywords

Electromigration; Graphene; Lead free solder; Mechanical property; Microstructure

Indexed keywords

COPPER COMPOUNDS; DIFFERENTIAL SCANNING CALORIMETRY; DUCTILE FRACTURE; ELECTROMIGRATION; FRACTURE; GRAPHENE; INTERMETALLICS; LEAD-FREE SOLDERS; MECHANICAL PROPERTIES; MELTING; MICROSTRUCTURE; NANOSHEETS; SOLDERED JOINTS; SOLDERING ALLOYS; VICKERS HARDNESS; ZINC;

BALL SHEAR STRENGTH; DIFFERENTIAL SCANNING CALORIMETERS; DISPERSION STRENGTHENING; ELECTROMIGRATION ANALYSIS; GRAPHENE NANOSHEETS; MELTING CHARACTERISTICS; MICROSTRUCTURAL DEVELOPMENT; REFINED MICROSTRUCTURE;

TIN;

EID: 84878692912 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2013.05.124 Document Type: Article

Times cited : (83)

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