Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints

Journal of Alloys and Compounds

Volumn 564, Issue , 2013, Pages 35-41

  Wang, Chao Hong ^a   Shen, Han Ting ^a   Lai, Wei Han ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Barrier layer; Cu dissolution; Electromigration; Lead free solders

Indexed keywords

BARRIER LAYERS; CU DISSOLUTIONS; EFFECTIVE SUPPRESSION; ELECTROMIGRATION FORCES; FLIP-CHIP PACKAGING; INTERFACIAL STRUCTURES; LEAD FREE SOLDERS; LEAD-FREE SOLDER JOINT;

DISSOLUTION; FLIP CHIP DEVICES; NICKEL; SILVER; TIN;

ELECTROMIGRATION;

EID: 84875075845     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.02.053     Document Type: Article

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