Flux development for lead-free solders containing zinc

Journal of Electronic Materials

Volumn 29, Issue 10, 2000, Pages 1160-1163

  Vaynman, S ^a   Fine, M E ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; EUTECTICS; FATIGUE OF MATERIALS; FLUXES; SURFACE PHENOMENA; TIN ALLOYS; WETTING; ZINC ALLOYS;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0034293733     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0007-6     Document Type: Article

References (2)

1. H. Mavoori, et al., J. Electron. Mater. 26, 783 (1997).
2. M.E. Loomans, S. Vaynman, G. Ghosh, and M.E. Fine, J. Electron. Mater. 23, 741 (1994).