SCOPUS 정보 검색 플랫폼

Volumn 567, Issue , 2013, Pages 47-53

Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn-Cu binary and Cu-Sn-Cu sandwich structures

Author keywords

Cu3Sn; Intermetallic compounds; Microstructures; Microvoids; Ultra thin solder

Indexed keywords

CLEANING PROCESS; INTERFACIAL PHENOMENA; LAYER THICKNESS; MICRO VOIDS; PEAK TEMPERATURES; SOLDER MATERIAL; TRIPLE JUNCTION; ULTRA-THIN;

GRAIN BOUNDARIES; INTERMETALLICS; MICROSTRUCTURE; SANDWICH STRUCTURES; SOLDERING ALLOYS; THICKNESS MEASUREMENT; TIN ALLOYS;

TIN;

EID: 84875943318 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2013.03.093 Document Type: Article

Times cited : (55)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.