Dramatic morphological change of interfacial prism-type Cu 6Sn 5 in the Sn3.5Ag/Cu joints reflowed by induction heating

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 843-846

  Wang, Ling ^a   Xu, Hongbo ^b   Yang, Ming ^b   Li, Mingyu ^b   Fu, Yonggao ^a  

^a China National Electric Apparatus Research   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; CU ATOMS; ELECTRONIC PACKAGING; ELECTRONIC PRODUCT; ELEVATED TEMPERATURE; HEATING PROCESS; HIGHER MELTING POINTS; HOT AIR; INTERCONNECTION TECHNOLOGY; INTERFACIAL INTERMETALLICS; INTERFACIAL REACTIONS; KEY TECHNOLOGIES; LEAD FREE SOLDERS; LEAD-FREE BGA; LEAD-FREE PROCESS; LEAD-TIN SOLDERS; MORPHOLOGICAL CHANGES; NEW CONCEPT; REFLOW TEMPERATURES; SELECTIVE HEATING; SERVICE RELIABILITY; SOLDER JOINTS; SOLID-SOLID; SOLID-STATE AGING; SQUARE ROOTS; THERMAL CHARACTERISTICS; WARPAGES;

ELECTRIC CURRENTS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; GROWTH KINETICS; HEATING; INDUCTION HEATING; MELTING POINT; PACKAGING; PRISMS; REACTION KINETICS; RELIABILITY; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; TECHNOLOGY; TIN;

LEAD;

EID: 70449945186     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270627     Document Type: Conference Paper

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