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Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 3, 2012, Pages 681-687

Effect of TiO 2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish

(3) Tsao, L C a Wu, M W b Chang, S Y c

a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

b NATIONAL FORMOSA UNIVERSITY (Taiwan)

c NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY PACKAGES; BGA PACKAGE; BONDING STRENGTH; COMPOSITE SOLDERS; DIMPLED SURFACES; DUCTILE FAILURES; FRACTURE MODE; FRACTURE SURFACES; IMC LAYER; IMMERSION SN; INTERFACIAL MICROSTRUCTURE; NANOPARTICLE ADDITION; SMOOTH SURFACE; SN-0.7CU; SOLDER JOINTS; SURFACE FINISHES; TIO;

BOND STRENGTH (CHEMICAL); BRITTLE FRACTURE; DIFFUSION BONDING; FINISHING; MICROSTRUCTURE; NANOPARTICLES; SOLDERED JOINTS; SOLDERING ALLOYS; TITANIUM DIOXIDE;

TIN;

EID: 84859721091 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-011-0471-1 Document Type: Article

Times cited : (41)

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