Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads

Journal of Electronic Materials

Volumn 36, Issue 7, 2007, Pages 753-759

  Lin, W H ^a,b   Wu, Albert T ^c   Lin, S Z ^a   Chuang, T H ^a   Tu, K N ^d  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Phoenix Precision Technology Corporation   (Taiwan)

^c NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^d UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Current crowding; Electromigration; Flip chip; Joule heating; Sn 8Zn 3Bi

Indexed keywords

CURRENT CROWDING; SN-8ZN-3BI; VOID FORMATION;

CURRENT DENSITY; ELECTROMIGRATION; INTERMETALLICS; JOULE HEATING; SOLDERED JOINTS;

FLIP CHIP DEVICES;

EID: 34547456938     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0139-z     Document Type: Article

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