Study of processing variables on the electrical resistivity of conductive adhesives

International Journal of Adhesion and Adhesives

Volumn 29, Issue 5, 2009, Pages 488-494

  Wu, Zhenhua ^a   Li, Jianzhi ^a   Timmer, Douglas ^a   Lozano, Karen ^a   Bose, Subhash ^a  

^a UNIVERSITY OF TEXAS PAN AMERICAN   (United States)

Author keywords

Bulk resistivity; Electrically conductive adhesives; Processing variables; Response surface methodology

Indexed keywords

CARBON NANOTUBES; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; SURFACE PROPERTIES;

ASSEMBLY PRESSURES; BULK RESISTIVITY; CONDUCTIVE ADHESIVES; ELECTRICAL CONDUCTIVITIES; ELECTRICAL RESISTIVITIES; ELECTRICALLY CONDUCTIVE ADHESIVES; EXPERIMENTAL DATUM; MAIN EFFECTS; PROCESSING TEMPERATURES; PROCESSING VARIABLES; RESPONSE FUNCTIONS; RESPONSE SURFACE METHODOLOGY;

ADHESIVES;

EID: 62249136312     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2008.10.003     Document Type: Article

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