Electrical and thermal properties of electrically conductive adhesives using a heat-resistant epoxy binder

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1147-1151

  Inoue, Masahiro ^a,c   Liu, Johan ^a,b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; CURING; ELECTRIC RESISTANCE; HEAT RESISTANCE; MECHANICAL PROPERTIES; MECHANISMS; RESINS; SILVER; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES;

CONDUCTIVE ADHESIVES; CURING CONDITIONS; ELECTRICAL RESISTIVITIES; ELECTRICALLY CONDUCTIVE ADHESIVES; EPOXY BINDERS; EPOXY MATRIXES; HEAT RESISTANTS; INTERMEDIATE TEMPERATURE RANGES; MATRIX RESINS; MULTI-FUNCTIONAL; PLANE DIRECTIONS; POTENTIALLY STABLES; REACTIVE DILUENTS; RELAXATION MECHANISMS; THERMAL PROPERTIES; THERMO-MECHANICAL PROPERTIES;

EPOXY RESINS;

EID: 58149088977     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684514     Document Type: Conference Paper

References (11)

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