Temperature dependence of electrical and thermal conductivities of an epoxy-based isotropic conductive adhesive

Journal of Electronic Materials

Volumn 37, Issue 4, 2008, Pages 462-468

  Inoue, Masahiro ^a   Muta, Hiroaki ^a   Maekawa, Takuji ^a   Yamanaka, Shinsuke ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Curing; Electrical resistivity; Isotropic conductive adhesives; Temperature coefficient of resistivity; Thermal conductivity

Indexed keywords

ADHESIVES; BINDERS; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; GLASS TRANSITION; SUPERCONDUCTING TRANSITION TEMPERATURE; THERMAL CONDUCTIVITY;

ABSOLUTE VALUES; CONDUCTIVE ADHESIVES; TEMPERATURE COEFFICIENT OF RESISTIVITY (TCR); TEMPERATURE DEPENDENCE;

EPOXY RESINS;

EID: 39849096850     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0378-z     Document Type: Article

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