Effects of BN and SiC nanoparticles on properties of conductive adhesive

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 235-239

  Lai, Huaxiang ^a   Lu, Xiuzhen ^a   Cui, Huiwang ^a,b   Liu, Xiaohua ^b   Chen, Si ^a,b   Chen, Tianan ^a   Liu, Johan ^a,c,d  

^a SHANGHAI UNIVERSITY   (China)

^b SMIT Ltd Co   (China)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^d SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP COMPONENT; CONDUCTIVE ADHESIVE; CYCLING TESTS; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESISTANCES; HIGH-DENSITY PACKAGING; HUMIDITY TESTS; INTERCONNECT MATERIALS; ISOTROPIC CONDUCTIVE ADHESIVES; MATRIX; NANOPARTICALS; NITRIDE NANOPARTICLES; RAMPING RATE; SCANNING ELECTRON MICROSCOPES; SIC NANOPARTICLES; SOAKING TIME; STENCIL PRINTING; THERMAL CYCLING AGING;

ADHESIVES; BORON; CRACKS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; HEAT RESISTANCE; INDEPENDENT COMPONENT ANALYSIS; NANOPARTICLES; NITRIDES; PACKAGING; POLYCHLORINATED BIPHENYLS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; SOLDERING ALLOYS; TELECOMMUNICATION EQUIPMENT; WATER ABSORPTION;

SILVER;

EID: 78449295781     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582434     Document Type: Conference Paper

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