Spatial distribution of metal fillers in isotropically conductive adhesives

Journal of Electronic Materials

Volumn 30, Issue 7, 2001, Pages 866-871

  Fu, Y ^a   Willander, M ^a   Liu, J ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

ICA; Microfillers; Nanofillers

Indexed keywords

ELECTRIC CONDUCTANCE; ELECTRIC CONDUCTIVITY OF SOLIDS; FILLERS; NANOSTRUCTURED MATERIALS; PERCOLATION (SOLID STATE); SURFACE TENSION;

ISOTROPICALLY CONDUCTIVE ADHESIVES; METAL FILLERS; NANOFILLERS;

ADHESIVES;

EID: 0035392379     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0073-4     Document Type: Article

References (13)