New fast curing isotropic conductive adhesive for electronic packaging application

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 199-201

  Du, Wenhui ^a   Fu, Chune ^a   Chen, Si ^a,b   Cui, Huiwang ^a   Liu, Xiaohua ^b   Chen, Tianan ^a   Liu, Johan ^a,c,d  

^a SHANGHAI UNIVERSITY   (China)

^b SMIT Ltd Co   (China)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^d SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BULK RESISTIVITY; CURING AGENTS; CURING RATES; CURING TEMPERATURE; CURING TIME; ELECTRICAL CONDUCTIVITY; ELECTRONIC INDUSTRIES; ELECTRONIC PACKAGING; FAST CURING; FILLER CONTENTS; HIGH DENSITY; ISOTROPIC CONDUCTIVE ADHESIVES; LOW PROCESSING TEMPERATURE; MANUFACTURABILITY; PROCESSING CONDITION; PRODUCT MANUFACTURING; RAPID DEVELOPMENT;

ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; INDEPENDENT COMPONENT ANALYSIS; PACKAGING; PROCESSING; VISCOSITY;

CURING;

EID: 78449278248     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582446     Document Type: Conference Paper

References (8)

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