Greencool: An energy-efficient liquid cooling design technique for 3-D MPSoCs via channel width modulation

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 32, Issue 4, 2013, Pages 524-537

  Sabry, Mohamed M ^a   Sridhar, Arvind ^b   Meng, Jie ^b   Coskun, Ayse K ^b   Atienza, David ^a  

^a EPFL   (Switzerland)

^b Boston University   (United States)

Author keywords

3 D ICs; energy efficiency; liquid cooling

Indexed keywords

3-D ICS; CHANNEL MODULATION; DYNAMIC RANDOM ACCESS MEMORY; HEAT TRANSFER CHARACTERISTICS; LIQUID COOLING; MULTIPROCESSOR SYSTEM ON CHIPS; PACKAGING TECHNOLOGIES; PROCESS TECHNOLOGIES;

COOLING; ENERGY EFFICIENCY; EXPERIMENTS; INTEGRATED CIRCUITS; MICROCHANNELS; MODULATION; MULTIPROCESSING SYSTEMS; THERMAL GRADIENTS;

LIQUIDS;

EID: 84875128465     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2012.2226032     Document Type: Article

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