Hotspot-optimized interlayer cooling in vertically integrated packages

Materials Research Society Symposium Proceedings

Volumn 1112, Issue , 2009, Pages 223-234

  Brunschwiler, T ^a   Michel, B ^a   Rothuizen, H ^a   Kloter, U ^a   Wunderle, B ^c   Reichl, H ^b  

^a IBM RESEARCH ZURICH   (Switzerland)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BUILDING BLOCKES; COOLING CAPABILITY; FLUID FRICTION; HOT SPOT; HYDRAULIC DIAMETER; INTERCONNECT DENSITIES; JUNCTION TEMPERATURES; MULTIPLE LOGIC; PIN FIN ARRAYS; SENSIBLE HEAT; THERMAL RESISTANCE;

COOLING; FLUIDS; HEAT EXCHANGERS;

THREE DIMENSIONAL;

EID: 70449589824     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. K. Bernstein et al., "Interconnects in the Third Dimension: Design Challenges for 3D lCs", Proc. Design Automation Conference, San Diego CA, pp. 562-567 (2007).
3. R. Linderman, T. Brunschwiler, U. Kloter, H. Toy, and B. Michel, "Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces", Proc. 23rd Annual IEEE Semiconductor Thermal Measurement and Management Symp. SEMI-THERM 2007, San Jose, CA, pp. 87-94 (2007).
4. E.G. Colgan et al., "A Practical Implementation of Silicon MicroChannel Coolers for High Power Chips", IEEE Trans. Components Packaging Technol., Vol. 30, No. 2, pp. 218-225 (2007).
5. T. Brunschwiler, H. Rothuizen, M. Fabbri, U. Kloter, and B. Michel, "Direct Liquid-Jet Impingement Cooling with Micron-Sized Nozzle Array and Distributed Return Architecture", Proc. ITHERM 2006, San Diego, CA, pp. 196-203 (2006).
6. T. Brunschwiler, B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, and H. Reichl, "Interlayer Cooling Potential in Vertically Integrated Packages", Microsystem Technol., Vol. 15, No. 1, pp. 57-74 (2009, published online August 21, 2008).
7. H. Hamann, J. Lacey, A. Weger, and J. Wakil, "Spatially-Resolved Imaging of Microprocessor Power (SIMP): Hotspots in Microprocessors", Proc. ITHERM 2006, San Diego, CA, pp. 121-125 (2006).