Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2011, Pages 116-124

  Brunschwiler, T ^a   Paredes, S ^a   Drechsler, U ^a   Michel, B ^a   Wunderle, B ^b   Reichl, H ^b  

^a IBM RESEARCH ZURICH   (Switzerland)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Angle of attack; interlayer cooling; multi scale modeling; nonuniform heat transfer; pin fin; porous media

Indexed keywords

INTERLAYER COOLING; MULTI-SCALE MODELING; NONUNIFORM HEAT TRANSFER; PIN-FIN; POROUS MEDIA;

ANGLE OF ATTACK; FLOW OF FLUIDS; FLUIDS; HEAT TRANSFER; MASS TRANSFER; MICROPROCESSOR CHIPS; POROUS MATERIALS; TABLE LOOKUP; THERMAL VARIABLES MEASUREMENT;

FINS (HEAT EXCHANGE);

EID: 79957631276     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2011.5767188     Document Type: Conference Paper

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