Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux

Journal of Heat Transfer

Volumn 132, Issue 4, 2010, Pages 1-9

  Kim, Yoon Jo ^a   Joshi, Yogendra K ^a   Fedorov, Andrei G ^a   Lee, Young Joon ^b   Lim, Sung Kyu ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Microchannel; Microfluidic cooling; Nonuniform heat flux; Pressure drop; Single phase; Three dimensional IC; Two phase

Indexed keywords

COOLING MODE; COOLING SCHEME; ELECTRICAL INTERCONNECTS; ENABLING TECHNOLOGIES; HOT SPOT; HOTSPOTS; HYBRID COOLING; HYDRAULIC PERFORMANCE; INTERNAL PRESSURE; LIMITING FACTORS; MASS FLOW RATE; NONUNIFORM; PHASE CHANGES; PUMPING PRESSURE; SINGLE-PHASE; SYSTEM INTEGRATION; THERMAL CHARACTERIZATION; THERMAL DESIGNS; THERMAL MANAGEMENT; THREE DIMENSIONAL INTEGRATED CIRCUITS; THREE-DIMENSIONAL (3D); THREE-DIMENSIONAL IC; THROUGH-SILICON-VIA;

HEAT FLUX; INTEGRATED CIRCUITS; MASS TRANSFER; MICROCHANNELS; MICROFLUIDICS; PIPE FLOW; PRESSURE DROP; REFRIGERANTS; TEMPERATURE CONTROL; THREE DIMENSIONAL;

COOLING;

EID: 77955302194     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.4000885     Document Type: Article

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