Modeling and dynamic management of 3D multicore systems with liquid cooling

Proceedings - 17th IFIP International Conference on Very Large Scale Integration, VLSI-SoC 2009

Volumn , Issue , 2009, Pages 35-40

  Coskun, Ayse K ^a   Ayala, Jose L ^b   Atienza, David ^c   Rosing, Tajana Simunic ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSIDAD COMPLUTENSE DE MADRID   (Spain)

^c EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COOLING SYSTEMS; DELAY CIRCUITS; HEAT PROBLEMS; LIQUIDS; THERMOANALYSIS; VLSI CIRCUITS;

3D THERMAL SIMULATION; COMMUNICATION DELAYS; COOLING EFFICIENCY; FEEDBACK CONTROLLER; MULTI-LAYER ARCHITECTURES; PROACTIVE MANAGEMENT; THREE-DIMENSIONAL (3D) CIRCUITS; VERTICAL INTEGRATION;

THERMAL MANAGEMENT (ELECTRONICS);

EID: 80555154158     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VLSISOC.2009.6041327     Document Type: Conference Paper

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