3D integrated water cooling of a composite multilayer stack of chips

Journal of Heat Transfer

Volumn 132, Issue 12, 2010, Pages

  Alfieri, Fabio ^a   Tiwari, Manish K ^a   Zinovik, Igor ^a   Poulikakos, Dimos ^a   Brunschwiler, Thomas ^b   Michel, Bruno ^b  

^a ETH ZURICH   (Switzerland)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

3D chip stack; conjugate heat transfer modeling; integrated water cooling; micropin fin; nonthermal equilibrium; thin porous medium; variable properties

Indexed keywords

3D CHIP STACK; CONJUGATE HEAT TRANSFER; INTEGRATED WATER COOLING; MICROPINS; NONTHERMAL EQUILIBRIUM; POROUS MEDIUM; VARIABLE PROPERTIES;

AIR; COMPUTATIONAL FLUID DYNAMICS; COOLING; FINS (HEAT EXCHANGE); FLUID DYNAMICS; FORCED CONVECTION; HEAT FLUX; HEAT RESISTANCE; HYDRODYNAMICS; INLET FLOW; MICROCHANNELS; MULTILAYERS; POROUS MATERIALS; SUPERCOMPUTERS; THERMAL GRADIENTS; WATER COOLING SYSTEMS;

THREE DIMENSIONAL;

EID: 79952129852     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.4002287     Document Type: Article

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