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Volumn 11, Issue 1, 2012, Pages 8-11

Resistive programmable through-silicon vias for reconfigurable 3-D fabrics

Author keywords

3 D integration; Memristive systems; memristor; resistive RAM (ReRAM); through silicon via (TSV); titanium dioxide rm (TiO 2)

Indexed keywords

3-D INTEGRATION; MEMRISTOR; RESISTIVE RAM (RERAM); THROUGH-SILICON VIA (TSV); TIO;

EID: 84855683107     PISSN: 1536125X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNANO.2011.2160557     Document Type: Article
Times cited : (23)

References (10)
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    • Chua, L.1    Kang, S.M.2
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    • (2010) Nature , vol.464 , pp. 873-876
    • Borghetti, J.1    Snider, G.S.2    Kuekes, P.J.3    Yang, J.J.4    Stewart, D.R.5    Williams, R.S.6
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    • J. J. Yang, M. D. Pickett, X. Li, D. A. A. Ohlberg, D. R. Stewart, and R. S.Williams, "Memristive switchingmechanism for metal//oxide//metal nanodevices," Nat. Nano, vol. 3, no. 7, pp. 429-433, Jul. 2008.
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    • Diebold, U.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.