Electrodeposition and characterisation of Sn-Ag-Cu solder alloys for flip-chip interconnection

Electrochimica Acta

Volumn 56, Issue 1, 2010, Pages 183-192

  Qin, Yi ^a   Wilcox, G D ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Cathodic polarisation; Electrodeposition; Flip chip interconnection; Lead free solder; Sn Ag Cu alloy

Indexed keywords

CHARACTERISATION; CROSS SECTIONAL IMAGE; FINE PITCH; FLIP-CHIP INTERCONNECTION; FOCUSED ION BEAM-SCANNING ELECTRON MICROSCOPIES; LEAD FREE SOLDERS; LEAD-FREE SOLDER; NEAR-EUTECTIC SN-AG-CU SOLDERS; POLARISATION; SEM; SN-AG-CU; SN-AG-CU ALLOY; SNAGCU SOLDER; TEM; TEST WAFERS; WAVELENGTH DISPERSIVE X-RAY SPECTROSCOPIES;

COPPER; COPPER ALLOYS; ELECTRODEPOSITION; EUTECTICS; FLIP CHIP DEVICES; INTERMETALLICS; METALLIC FILMS; MORPHOLOGY; POLARIZATION; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SUPERCONDUCTING TAPES; TERNARY SYSTEMS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; WAVELENGTH DISPERSIVE SPECTROSCOPY; X RAY DIFFRACTION; X RAY SPECTROSCOPY;

TIN;

EID: 78650032019     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2010.08.102     Document Type: Article

References (22)

1. M. Juergen Wolf, G. Engelmann, L. Dietrich, and H. Reichl Nucl. Instrum. Methods Phys. Res. A 565 2006 290
2. M. Datta Electrochim. Acta 48 2003 2975
3. P.A. Gruber, L.B. Langer, G.P. Brouillette, D.H. Danovitch, J.L. Landreville, D.T. Naugle, V.A. Oberson, D.Y. Shih, C.L. Tessler, and M.R. Turgeon IBM J. Res. Develop. 49 2005 621
4. V. Eveloy, S. Ganesan, Y. Fukuda, J. Wu, and M.G. Pecht IEEE Trans. Compon. Packag. Technol. 28 2005 884
5. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang Mater. Sci. Eng. R 44 2004 1
6. I. Anderson K.N. Subramanian, Lead-Free Electronic Solders 2007 Springer USA
7. M. Abtew, and G. Selvaduray Mater. Sci. Eng. R 27 2000 95
8. K.-L. Lin, and L.-M. Sun J. Mater. Res. 18 2003 2203
9. Y.-D. Tsai, C.-C. Hu, and C.-C. Lin Electrochim. Acta 53 2007 2040
10. M. Bigas, and E. Cabruja Microelectron. Eng. 83 2006 399
11. M. Fukuda, K. Imayoshi, and Y. Matsumoto J. Electrochem. Soc. 149 2002 C244
12. S. Joseph, and G.J. Phatak Surf. Coat. Technol. 202 2008 3023
13. J. Zhang, M. An, L. Chang, and G. Liu Electrochim. Acta 53 2008 2637
14. S. Glodowski, and Z. Kublik Anal. Chim. Acta 130 1981 133
15. W.M. Murray, and N.H. Furman J. Am. Chem. Soc. 58 1936 1843
16. R.E. Messier, and R.R. Irani J. Inorg. Nucl. Chem. 28 1966 493
17. S.D. Beattie, and J.R. Dahn J. Electrochem. Soc. 150 2003 C457
18. B. Neveu, F. Lallemand, G. Poupon, and Z. Mekhalif Appl. Surf. Sci. 252 2006 3561
19. Y. Qin, G.D. Wilcox, and C. Liu J. Electrochem. Soc. 156 2009 D424
20. A. Ul-Hamid, H.M. Tawancy, A.-R.I. Mohammed, S.S. Al-Jaroudi, and N.M. Abbas Mater. Charact. 56 2006 192
21. M. Kerr, and N. Chawla Acta Mater. 52 2004 4527
22. T.B. Massalski, J.L. Murray, L.H. Bennett, and H. Baker Binary Alloy Phase Diagrams vol. 1 1996 ASM International Ohio