Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

Journal of Alloys and Compounds

Volumn 487, Issue 1-2, 2009, Pages 682-686

  Zhang, Shasha ^a   Zhang, Yijie ^a   Wang, Haowei ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

AES; Coalescence; Lead free solder; Oxide thickness; SEM; XPS

Indexed keywords

AES; LEAD-FREE SOLDER; OXIDE THICKNESS; SEM; XPS;

COALESCENCE; LEAD; METAL RECOVERY; SILVER; SOLDERING ALLOYS; TIN; X RAY PHOTOELECTRON SPECTROSCOPY;

OXIDE FILMS;

EID: 70350621877     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.08.035     Document Type: Article

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