A study of the thin film on the surface of Sn-3.5Ag/Sn-3.5Ag-2.0Cu lead-free alloy

Journal of Alloys and Compounds

Volumn 415, Issue 1-2, 2006, Pages 85-92

  Hung, Fei Yi ^a   Lin, Hung Mao ^a   Chen, Puo Sheng ^a   Lui, Truan Sheng ^a   Chen, Li Hui ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Lead free solder; Oxide film; Sn Ag; Sn Ag Cu; TEM; XPS; XRD

Indexed keywords

ALLOYS; COPPER ALLOYS; OXIDATION; SOLIDIFICATION; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

LEAD-FREE SOLDER; OXIDE FILMS; SN-AG; SN-AG-CU;

THIN FILMS;

EID: 33646147807     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2005.07.050     Document Type: Article

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