Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 6, 2011, Pages 659-665

  Xiao, Zhengxiang ^a   Xue, Songbai ^a   Hu, Yuhua ^a   Ye, Huan ^a   Gao, Lili ^a   Wang, Hui ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPREHENSIVE PROPERTIES; IMC LAYER; LEAD-FREE SOLDER ALLOY; NEEDLE-LIKE; PROPERTIES AND MICROSTRUCTURES; SN-9ZN SOLDER; TEST RESULTS; TRACE AMOUNTS;

ALLOYS; BEARINGS (MACHINE PARTS); CERIUM ALLOYS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS; ZINC;

TIN;

EID: 79958851447     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-010-0192-x     Document Type: Article

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