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Volumn 33, Issue 1, 2012, Pages 85-88

Effects of addition of rare earth element Nd on properties of Sn-9Zn lead-free solder

Author keywords

Lead free solder Sn Zn; Mechanical properties; Microstruture; Rare earth element Nd; Wettbility

Indexed keywords

LEAD FREE SOLDERS; MICROSTRUCTURE AND MECHANICAL PROPERTIES; MICROSTRUTURE; PULL FORCE; SHEAR FORCE; SN-9ZN SOLDER; TRACE AMOUNTS; WETTBILITY;

EID: 84863125803     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (5)

References (10)
  • 1
    • 59249100068 scopus 로고    scopus 로고
    • Effect of a trace of Cr on intermetallic compound layer for tin-zinc lead-free solder joint during aging
    • Chen X, Hu A M, Li M, et al. Effect of a trace of Cr on intermetallic compound layer for tin-zinc lead-free solder joint during aging[J]. Journal of Alloys and Compounds, 2009, 470(1-2): 429-433.
    • (2009) Journal of Alloys and Compounds , vol.470 , Issue.1-2 , pp. 429-433
    • Chen, X.1    Hu, A.M.2    Li, M.3
  • 2
    • 60949113923 scopus 로고    scopus 로고
    • Effect of temperature on microstructural changes of the Sn-9wt% Zn lead-free solder stripe under current stressing
    • Chen Chihming, Hung Yumin, Lin Chipu, et al. Effect of temperature on microstructural changes of the Sn-9wt% Zn lead-free solder stripe under current stressing[J]. Materials Chemistry and Physics, 2009, 115(1): 367-370.
    • (2009) Materials Chemistry and Physics , vol.115 , Issue.1 , pp. 367-370
    • Chen, C.1    Hung, Y.2    Lin, C.3
  • 3
    • 27644553870 scopus 로고    scopus 로고
    • The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu
    • Nai S L, Lin K L. The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu[J]. Scripta Materialia, 2006, 54(2): 219-224.
    • (2006) Scripta Materialia , vol.54 , Issue.2 , pp. 219-224
    • Nai, S.L.1    Lin, K.L.2
  • 5
    • 51249161820 scopus 로고
    • In search of new lead-free electronic solders
    • Wood E P, Nimmo K L. In search of new lead-free electronic solders[J]. Journal of Electronic Materials, 1994, 23(8): 709-713.
    • (1994) Journal of Electronic Materials , vol.23 , Issue.8 , pp. 709-713
    • Wood, E.P.1    Nimmo, K.L.2
  • 6
    • 34250007989 scopus 로고    scopus 로고
    • Review of JIS Z 3198: Test method for lead-free solders
    • Wang Chunqing, Li Mingyu, Tian Yanhong, et al. Review of JIS Z 3198: Test method for lead-free solders[J]. Electronics Process Technology, 2004, 25(3): 50-54.
    • (2004) Electronics Process Technology , vol.25 , Issue.3 , pp. 50-54
    • Wang, C.1    Li, M.2    Tian, Y.3
  • 7
    • 84863173140 scopus 로고    scopus 로고
    • Japanese source
    • 2003.
    • (2003)
  • 8
    • 40349114531 scopus 로고    scopus 로고
    • Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
    • Shi Y W, Tian J, Hao H, et al. Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder[J]. Journal of Alloys and Compounds, 2008, 453(1-2): 180-184.
    • (2008) Journal of Alloys and Compounds , vol.453 , Issue.1-2 , pp. 180-184
    • Shi, Y.W.1    Tian, J.2    Hao, H.3
  • 9
    • 17144387501 scopus 로고    scopus 로고
    • Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
    • Li B, Shi Y W, Lei Y P, et al. Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint[J]. Journal of Electronic Materials, 2005, 34(3): 217-224.
    • (2005) Journal of Electronic Materials , vol.34 , Issue.3 , pp. 217-224
    • Li, B.1    Shi, Y.W.2    Lei, Y.P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.