Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies

Procedia Engineering

Volumn 2, Issue 1, 2010, Pages 1477-1486

  Dompierre, B ^a,b,c,d   Aubin, V ^a,b,c   Charkaluk, E ^a,c   Maia Filho, W C ^d   Brizoux, M ^d  

^a UNIV LILLE   (France)

^b LABORATOIRE DE MÉCANIQUE DE LILLE   (France)

^c CNRS   (France)

^d THALES   (France)

Author keywords

Electronic assemblies; Lead free solder material; Low cycle fatigue; Solder ball compression; Thermal ageing

Indexed keywords

ELECTRONIC ASSEMBLIES; LEAD-FREE SOLDER MATERIALS; LOW CYCLE FATIGUES; SOLDER BALLS; THERMAL AGEING;

ALLOYS; COMPUTER SIMULATION; CONSTITUTIVE MODELS; FATIGUE OF MATERIALS; LEAD; MECHANICAL PROPERTIES; MICROELECTRONICS; MICROSTRUCTURE; TENSILE TESTING;

SOLDERING;

EID: 77954091045     PISSN: None     EISSN: 18777058     Source Type: Conference Proceeding    
DOI: 10.1016/j.proeng.2010.03.159     Document Type: Conference Paper

References (5)

1. H. Ma, Y. Zhang, Z. Cai, J.C. Suhling, P. Lall, and M.J. Bozack, "Aging induced evolution of free solder material behavior," Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (EuroSimE), Freiburg, Germany: 2008, pp. 335-346.
2. M. Mueller, S. Wiese, M. Roellig, and K. Wolter, "The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders," Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. (EuroSimE), London, Great-Britain: 2007, pp. 1-10.
3. B. Dompierre, V. Aubin, E. Charkaluk, W. Maia Filho, and M. Brizoux, "Influence of Thermal Ageing on Long Term Reliability of SnAgCu Solder Joints," Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (EuroSimE), Delft, Nederland: 2009, p. A chercher.
4. E. Charkaluk, "Dimensionnement des structures a la fatigue thermomecanique," PhD Thesis, Ecole Polytechnique, 1999 (in french).
5. A. LaLonde, D. Emelander, J. Jeannette, C. Larson, W. Rietz, D. Swenson, and D. Henderson, "Quantitative metallography of Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy," Journal of Electronic Materials, vol.33, 2004, pp. 1545-1549.