The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads

Materials Letters

Volumn 64, Issue 4, 2010, Pages 506-509

  Lin, Hsiu Jen ^a,b   Chuang, Tung Han ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Diffusion; Electromigration; Rare earth elements; Sn 9Zn; Sn 9Zn 0.5Ce

Indexed keywords

CE ADDITION; CURRENT-STRESSING; ELECTROMIGRATION BEHAVIOR; ELECTRON FLOW; FINER GRAINS; ROOM TEMPERATURE; SN-9ZN SOLDER; SOLDER JOINTS; WHISKER GROWTH;

ALLOYS; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; COPPER ALLOYS; ELECTROMIGRATION; GOLD ALLOYS; MECHANICAL PROPERTIES; TIN ALLOYS; ZINC;

TIN;

EID: 72649098212     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.11.058     Document Type: Article

References (15)

1. Zeng K., and Tu K.N. Mater Sci Eng R 38 (2002) 55-105
2. Wu C.M.L., Law C.M.T., Yu D.Q., and Wang L. J Electron Mater 32 (2003) 63-69
3. Wu C.M.L., Yu D.Q., Law C.M.T., and Wang L. J Electron Mater 31 (2002) 921-927
4. Shi Y.W., Tian J., Hao H., Xia Z.D., Lei Y.P., and Guo F. J Alloys Compd 453 (2008) 180-184
5. Dudek M.A., Sidhu R.S., Chawla N., and Renavikar M. J Electron Mater 35 (2006) 2088-2097
6. Wu C.M.L., Yu D.Q., Law C.M.T., and Wang L. Mater Sci Eng R 44 (2004) 1-44
7. Chuang T.H. Metall Mater Trans 38A (2007) 1048-1055
8. Chuang T.H. Scr Mater 55 (2006) 983-986
9. Chuang T.H., and Lin H.J. Metall Mater Trans 39A (2008) 2862-2866
10. Dudek M.A. Chawla N. Acta Mater 57 (2009) 4588-4599
11. Lin H.J., Chuang T.H. J Electron Mater, in press, doi:10.1007/s11664-009-0959-0.
12. Lin W.H., Wu A.T., Lin H.J., Chuang T.H., and Tu K.N. J Electron Mater 36 (2007) 753-759
13. Lee T.Y., Tu K.N., Kuo S.M., and Frear D.R. J Appl Phys 89 (2001) 3189-3194
14. Nah J.W., Suh J.O., and Tu K.N. J Appl Phys 98 (2005) 0137151-0137156
15. Lin Y.H., Hu Y.C., Tsai C.M., and Kao C.R. Tu KN. Acta Mater 53 (2005) 2029-2035