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Journal of Materials Science: Materials in Electronics
Volumn 22, Issue 8, 2011, Pages 1101-1108
Properties and microstructure of Sn-0.7Cu-0.05Ni solder bearing rare earth element Pr
Author keywords

[No Author keywords available]
Indexed keywords

IMC LAYER; LEAD FREE SOLDERS; LEAD-FREE SOLDER JOINT; PROPERTIES AND MICROSTRUCTURES; SHEAR TESTS; SOLDER ALLOYS; SOLDER JOINTS; SOLDERABILITY; TRACE AMOUNTS; WETTING BALANCE METHODS;
EID: 80051548475     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-010-0267-8     Document Type: Article
Times cited : (26)
References (29)
  • 1
    • 0035047957 scopus 로고    scopus 로고
    • Advances in lead-free electronics soldering
    • DOI 10.1016/S1359-0286(00)00036-X, PII S135902860000036X
    • K Suganuma 2001 Advances in lead-free electronics soldering Curr. Opin. Solid State Mater. Sci. 5 55 64 10.1016/S1359-0286(00)00036-X 1:CAS:528:DC%2BD3MXjslCiur0%3D (Pubitemid 32320603)
    • (2001) Current Opinion in Solid State and Materials Science , vol.5 , Issue.1 , pp. 55-64
    • Suganuma, K.1
  • 3
    • 20344388336 scopus 로고    scopus 로고
    • Interfacial reactions between lead-free solders and common base materials
    • DOI 10.1016/j.mser.2005.03.001, PII S0927796X05000513
    • T Laurila V Vuorinen J Kivilahti 2005 Interfacial reactions between lead-free solders and common base materials Mater. Sci. Eng. R 49 1 60 10.1016/j.mser.2005.03.001 (Pubitemid 40788671)
    • (2005) Materials Science and Engineering R: Reports , vol.49 , Issue.1-2 , pp. 1-60
    • Laurila, T.1    Vuorinen, V.2    Kivilahti, J.K.3
  • 4
    • 84892822433 scopus 로고    scopus 로고
    • Lead-free soldering
    • N. Lee, Lead-free soldering. Mater. Adv. Packag. 181-218 (2008)
    • (2008) Mater. Adv. Packag. , pp. 181-218
    • Lee, N.1
  • 5
    • 70349728579 scopus 로고    scopus 로고
    • Lead-free soldering: Materials science and solder joint reliability
    • K Zeng 2009 Lead-free soldering: materials science and solder joint reliability J. Miner. Metals Mater. Soc. 61 28
    • (2009) J. Miner. Metals Mater. Soc. , vol.61 , pp. 28
    • Zeng, K.1
  • 6
    • 33745056527 scopus 로고    scopus 로고
    • Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
    • H Nishikawa J Piao T Takemoto 2006 Interfacial reaction between Sn-0.7 Cu (-Ni) solder and Cu substrate J. Electron. Mater. 35 1127 1132 10.1007/BF02692576 1:CAS:528:DC%2BD28XlsVOit70%3D (Pubitemid 43875275)
    • (2006) Journal of Electronic Materials , vol.35 , Issue.5 , pp. 1127-1132
    • Nishikawa, H.1    Piao, J.Y.2    Takemoto, T.3
  • 7
    • 74449086197 scopus 로고    scopus 로고
    • Intermetallic formation and fluidity in Sn-rich Sn-Cu-Ni alloys
    • 10.1007/s11664-009-0962-5 1:CAS:528:DC%2BC3cXit12ksA%3D%3D
    • C Gourlay K Nogita J Read A Dahle 2010 Intermetallic formation and fluidity in Sn-rich Sn-Cu-Ni alloys J. Electron. Mater. 39 56 69 10.1007/s11664-009-0962-5 1:CAS:528:DC%2BC3cXit12ksA%3D%3D
    • (2010) J. Electron. Mater. , vol.39 , pp. 56-69
    • Gourlay, C.1    Nogita, K.2    Read, J.3    Dahle, A.4
  • 8
    • 37249093525 scopus 로고    scopus 로고
    • The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys
    • DOI 10.1007/s11664-007-0248-8
    • C Gourlay J Read K Nogita A Dahle 2008 The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys J. Electron. Mater. 37 51 60 10.1007/s11664-007-0248-8 1:CAS:528:DC%2BD1cXmtV2isw%3D%3D (Pubitemid 350276009)
    • (2008) Journal of Electronic Materials , vol.37 , Issue.1 , pp. 51-60
    • Gourlay, C.M.1    Read, J.2    Nogita, K.3    Dahle, A.K.4
  • 9
    • 60449094759 scopus 로고    scopus 로고
    • A review of mechanical properties of lead-free solders for electronic packaging
    • 10.1007/s10853-008-3125-9 1:CAS:528:DC%2BD1MXhtVWlsrw%3D
    • H Ma JC Suhling 2009 A review of mechanical properties of lead-free solders for electronic packaging J. Mater. Sci. 44 1141 1158 10.1007/s10853-008-3125-9 1:CAS:528:DC%2BD1MXhtVWlsrw%3D
    • (2009) J. Mater. Sci. , vol.44 , pp. 1141-1158
    • Ma, H.1    Suhling, J.C.2
  • 10
    • 37249000886 scopus 로고    scopus 로고
    • The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi
    • DOI 10.1007/s11664-007-0281-7
    • T Ventura C Gourlay K Nogita T Nishimura M Rappaz A Dahle 2008 The influence of 0-0.1 wt% Ni on the microstructure and fluidity length of Sn-0.7 Cu-x Ni J. Electron. Mater. 37 32 39 10.1007/s11664-007-0281-7 1:CAS:528:DC%2BD1cXmtV2jug%3D%3D (Pubitemid 350276006)
    • (2008) Journal of Electronic Materials , vol.37 , Issue.1 , pp. 32-39
    • Ventura, T.1    Gourlay, C.M.2    Nogita, K.3    Nishimura, T.4    Rappaz, M.5    Dahle, A.K.6
  • 11
    • 43449092170 scopus 로고    scopus 로고
    • 5 in Sn-Cu-Ni lead-free solder alloys
    • 10.1016/j.scriptamat.2008.03.002 1:CAS:528:DC%2BD1cXlvFKktr0%3D
    • 5 in Sn-Cu-Ni lead-free solder alloys Scripta Mater. 59 191 194 10.1016/j.scriptamat.2008.03.002 1:CAS:528:DC%2BD1cXlvFKktr0%3D
    • (2008) Scripta Mater. , vol.59 , pp. 191-194
    • Nogita, K.1    Nishimura, T.2
  • 12
    • 70349758109 scopus 로고    scopus 로고
    • 5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
    • 10.1016/j.intermet.2009.07.005 1:CAS:528:DC%2BD1MXht1CgurrN
    • 5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys Intermetallics 18 145 149 10.1016/j.intermet.2009.07.005 1:CAS:528:DC%2BD1MXht1CgurrN
    • (2010) Intermetallics , vol.18 , pp. 145-149
    • Nogita, K.1
  • 13
    • 34547114991 scopus 로고    scopus 로고
    • 5 (x = 0, 1, 2) intermetallic compounds
    • DOI 10.1016/j.intermet.2007.05.005, PII S0966979507001021
    • 5 (x = 0, 1, 2) intermetallic compounds Intermetallics 15 1471 1478 10.1016/j.intermet.2007.05.005 1:CAS:528:DC%2BD2sXot1Gns7Y%3D (Pubitemid 47102624)
    • (2007) Intermetallics , vol.15 , Issue.11 , pp. 1471-1478
    • Yu, C.1    Liu, J.2    Lu, H.3    Li, P.4    Chen, J.5
  • 16
    • 1642324965 scopus 로고    scopus 로고
    • Properties of lead-free solder alloys with rare earth element additions
    • 10.1016/j.mser.2004.01.001
    • C Wu D Yu C Law L Wang 2004 Properties of lead-free solder alloys with rare earth element additions Mater. Sci. Eng. R 44 1 44 10.1016/j.mser.2004.01. 001
    • (2004) Mater. Sci. Eng. R , vol.44 , pp. 1-44
    • Wu, C.1    Yu, D.2    Law, C.3    Wang, L.4
  • 17
    • 61449208110 scopus 로고    scopus 로고
    • Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint
    • 10.1016/j.jallcom.2008.04.044 1:CAS:528:DC%2BD1MXivVSrt78%3D
    • W Xiao Y Shi G Xu R Ren F Guo Z Xia Y Lei 2009 Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint J. Alloys Compd. 472 198 202 10.1016/j.jallcom.2008.04.044 1:CAS:528:DC%2BD1MXivVSrt78%3D
    • (2009) J. Alloys Compd. , vol.472 , pp. 198-202
    • Xiao, W.1    Shi, Y.2    Xu, G.3    Ren, R.4    Guo, F.5    Xia, Z.6    Lei, Y.7
  • 18
    • 37149054756 scopus 로고    scopus 로고
    • Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints
    • Y Shi S Xue J Wang L Gu W Gu 2007 Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints Hanjie Xuebao/Transact. China Weld. Inst. 28 73 77 1:CAS:528:DC%2BD1cXhtlCnt7s%3D (Pubitemid 350257667)
    • (2007) Hanjie Xuebao/Transactions of the China Welding Institution , vol.28 , Issue.11 , pp. 73-77
    • Shi, Y.1    Xue, S.2    Wang, J.3    Gu, L.4    Gu, W.5
  • 19
    • 56849085502 scopus 로고    scopus 로고
    • Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints
    • 10.1016/j.jallcom.2007.12.033 1:CAS:528:DC%2BD1cXhsVymtL3F
    • JX Wang SB Xue ZJ Han SL Yu Y Chen YP Shi H Wang 2009 Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints J. Alloys Compd. 467 219 226 10.1016/j.jallcom.2007.12.033 1:CAS:528:DC%2BD1cXhsVymtL3F
    • (2009) J. Alloys Compd. , vol.467 , pp. 219-226
    • Wang, J.X.1    Xue, S.B.2    Han, Z.J.3    Yu, S.L.4    Chen, Y.5    Shi, Y.P.6    Wang, H.7
  • 20
    • 67349099560 scopus 로고    scopus 로고
    • Effects of rare earths on properties and microstructures of lead-free solder alloys
    • 10.1007/s10854-009-9895-2 1:CAS:528:DC%2BD1MXmvVSlsbk%3D
    • L Zhang SB Xue LL Gao G Zeng Z Sheng Y Chen SL Yu 2009 Effects of rare earths on properties and microstructures of lead-free solder alloys J. Mater. Sci. Mater. Electron. 20 685 694 10.1007/s10854-009-9895-2 1:CAS:528: DC%2BD1MXmvVSlsbk%3D
    • (2009) J. Mater. Sci. Mater. Electron. , vol.20 , pp. 685-694
    • Zhang, L.1    Xue, S.B.2    Gao, L.L.3    Zeng, G.4    Sheng, Z.5    Chen, Y.6    Yu, S.L.7
  • 21
    • 40349114531 scopus 로고    scopus 로고
    • Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
    • DOI 10.1016/j.jallcom.2006.11.165, PII S0925838806019864
    • Y Shi J Tian H Hao Z Xia Y Lei F Guo 2008 Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder J. Alloys Compd. 453 180 184 10.1016/j.jallcom.2006.11.165 1:CAS:528: DC%2BD1cXjtV2rsbc%3D (Pubitemid 351337641)
    • (2008) Journal of Alloys and Compounds , vol.453 , Issue.1-2 , pp. 180-184
    • Shi, Y.1    Tian, J.2    Hao, H.3    Xia, Z.4    Lei, Y.5    Guo, F.6
  • 22
    • 3042758716 scopus 로고    scopus 로고
    • Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements
    • 10.1016/j.jallcom.2004.01.012 1:CAS:528:DC%2BD2cXlslygtrg%3D
    • D Yu J Zhao L Wang 2004 Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements J. Alloys Compd. 376 170 175 10.1016/j.jallcom.2004.01. 012 1:CAS:528:DC%2BD2cXlslygtrg%3D
    • (2004) J. Alloys Compd. , vol.376 , pp. 170-175
    • Yu, D.1    Zhao, J.2    Wang, L.3
  • 23
    • 67849107971 scopus 로고    scopus 로고
    • Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders
    • 10.1016/j.actamat.2009.06.031 1:CAS:528:DC%2BD1MXpt1CgsLc%3D
    • MA Dudek N Chawla 2009 Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders Acta Mater. 57 4588 4599 10.1016/j.actamat. 2009.06.031 1:CAS:528:DC%2BD1MXpt1CgsLc%3D
    • (2009) Acta Mater. , vol.57 , pp. 4588-4599
    • Dudek, M.A.1    Chawla, N.2
  • 24
    • 33846437828 scopus 로고    scopus 로고
    • Microstructure and mechanical behavior of novel rare earth-containing Pb-free solders
    • DOI 10.1007/s11664-006-0318-3
    • M Dudek R Sidhu N Chawla M Renavikar 2006 Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders J. Electron. Mater. 35 2088 2097 10.1007/s11664-006-0318-3 1:CAS:528:DC%2BD2sXms1eltw%3D%3D (Pubitemid 46140896)
    • (2006) Journal of Electronic Materials , vol.35 , Issue.12 , pp. 2088-2097
    • Dudek, M.A.1    Sidhu, R.S.2    Chawla, N.3    Renavikar, M.4
  • 25
    • 77950020933 scopus 로고    scopus 로고
    • Nanoindentation of rare earth-Sn intermetallics in Pb-free solders
    • 10.1016/j.intermet.2010.01.028 1:CAS:528:DC%2BC3cXkt1yhu70%3D
    • M Dudek N Chawla 2010 Nanoindentation of rare earth-Sn intermetallics in Pb-free solders Intermetallics 18 1016 1020 10.1016/j.intermet.2010.01.028 1:CAS:528:DC%2BC3cXkt1yhu70%3D
    • (2010) Intermetallics , vol.18 , pp. 1016-1020
    • Dudek, M.1    Chawla, N.2
  • 26
    • 0036840248 scopus 로고    scopus 로고
    • Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy
    • DOI 10.1016/S0167-577X(02)00672-9, PII S0167577X02006729
    • L Wang DQ Yu J Zhao ML Huang 2002 Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy Mater. Lett. 56 1039 1042 10.1016/S0167-577X(02)00672-9 1:CAS:528:DC%2BD38Xot1eqtrk%3D (Pubitemid 35276425)
    • (2002) Materials Letters , vol.56 , Issue.6 , pp. 1039-1042
    • Wang, L.1    Yu, D.Q.2    Zhao, J.3    Huang, M.L.4
  • 27
    • 33646148485 scopus 로고    scopus 로고
    • Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn-Cu/Ni solder joint
    • 10.1016/j.jallcom.2005.03.124 1:CAS:528:DC%2BD28XktFehtbw%3D
    • J Yoon S Kim S Jung 2006 Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn-Cu/Ni solder joint J. Alloys Compd. 415 56 61 10.1016/j.jallcom.2005.03.124 1:CAS:528:DC%2BD28XktFehtbw%3D
    • (2006) J. Alloys Compd. , vol.415 , pp. 56-61
    • Yoon, J.1    Kim, S.2    Jung, S.3
  • 28
    • 75949091469 scopus 로고    scopus 로고
    • Growth behavior of intermetallic compounds at SnAgCu/Ni and Cu interfaces
    • 10.1007/s11665-009-9423-9 1:CAS:528:DC%2BC3cXmt1aqtg%3D%3D
    • L Qi J Huang H Zhang X Zhao H Wang D Cheng 2010 Growth behavior of intermetallic compounds at SnAgCu/Ni and Cu interfaces J. Mater. Eng. Perform. 19 129 134 10.1007/s11665-009-9423-9 1:CAS:528:DC%2BC3cXmt1aqtg%3D%3D
    • (2010) J. Mater. Eng. Perform. , vol.19 , pp. 129-134
    • Qi, L.1    Huang, J.2    Zhang, H.3    Zhao, X.4    Wang, H.5    Cheng, D.6
  • 29
    • 77949490697 scopus 로고    scopus 로고
    • Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
    • 10.1016/j.mser.2009.12.001
    • T Laurila V Vuorinen M Paulasto-Kröckel 2010 Impurity and alloying effects on interfacial reaction layers in Pb-free soldering Mater. Sci. Eng. R Rep. 68 1 38 10.1016/j.mser.2009.12.001
    • (2010) Mater. Sci. Eng. R Rep. , vol.68 , pp. 1-38
    • Laurila, T.1    Vuorinen, V.2    Paulasto-Kröckel, M.3

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.