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Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 11, 2009, Pages 1083-1089

Rate-dependent deformation of Sn-3.5Ag lead-free solder

(3) Sefton, D E a Rist, M A a Gungor, S a

a OPEN UNIVERSITY (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED LOADING; APPLIED STRESS; CONSTITUTIVE BEHAVIOUR; FLOW BEHAVIOURS; INTERNAL BACK-STRESSES; INTERNAL STRESS; LINEAR HARDENING; MATRIX; PHASE PARTICLES; RATE EQUATIONS; RATE-DEPENDENT DEFORMATION; SN-3.5AG LEAD-FREE SOLDERS; STRESS EXPONENTS; TEMPERATURE RANGE;

ACTIVATION ENERGY; DEFORMATION; FLOW FIELDS; FLUID DYNAMICS; LEAD; METAL RECOVERY; SILVER; SILVER ALLOYS; STRESS-STRAIN CURVES; TIN;

STRAIN RATE;

EID: 70349427505 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-008-9830-y Document Type: Article

Times cited : (2)

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