Deposition of copper films with surface-activating agents

Organometallics

Volumn 31, Issue 22, 2012, Pages 7884-7892

  Thompson, Jeffery S ^a   Zhang, Lei ^a   Wyre, John P ^a   Brill, Donald ^a   Li, Zhigang ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACID-BASE REACTIONS; COMPLEX 1; COPPER COMPLEXES; COPPER FILMS; COPPER PRECURSORS; CU COMPLEXES; CVD PROCESS; DEPOSITION PROCESS; DEPOSITION REACTIONS; LOW-TEMPERATURE DEPOSITION; PYRAZOLES; SUBSTRATE SURFACE; SUBSTRATE TEMPERATURE; THERMAL REACTIONS; VAPOR PHASE;

COPPER; DECOMPOSITION; METALLIC FILMS; SILICON; SUBSTRATES; VAPORS;

COPPER COMPOUNDS;

EID: 84870174575     PISSN: 02767333     EISSN: 15206041     Source Type: Journal    
DOI: 10.1021/om3005383     Document Type: Article

References (58)

1. Leskelä, M.; Ritala, M. Angew. Chem., Int. Ed. 2003, 42, 5548
2. Ritala, M.; Leskelä, M. In Handbook of Thin Film Materials Vol. 1; Nalwa, H. S., Ed.; Academic Press: San Diego, 2001; p 103.
3. Zaera, F. J. Mater. Chem. 2008, 18, 3521
4. Leskelä, M.; Aaltonen, T.; Hamalainen, J.; Niskanen, A.; Ritala, M. Proc.-Electrochem. Soc. 2005, 2005-09 (EUROCVD-15) 545
5. Leskelä, M.; Ritala, M. Thin Solid Films 2002, 409, 138
6. Knisley, T. J.; Ariyasena, T. C.; Sajavaara, T.; Saly, M. J.; Winter, C. H. Chem. Mater. 2011, 23, 4417
7. Ma, Q.; Guo, H.; Gordon, R. G.; Zaera, F. Chem. Mater. 2011, 23, 3325
8. Dai, M.; Kwon, J.; Halls, M. D.; Gordon, R. G.; Chabal, Y. J. Langmuir 2010, 26, 3911
9. Wu, L.; Eisenbraun, E. J. Electrochem. Soc. 2009, 156, H734
10. Hsu, I. J.; McCandless, B. E.; Weiland, C.; Willis, B. G. J. Vac. Sci. Technol. A 2009, 27, 660
11. Lee, B. H.; Hwang, J. K.; Nam, J. W.; Lee, S. U.; Kim, J. T.; Koo, S.-M.; Baunemann, A.; Fischer, R. A.; Sung, M. M. Angew. Chem., Int. Ed 2009, 48, 4536
12. Moon, D.; Kim, W.; Kim, T.; Kang, B.; Park, J.; Yeom, S. J.; Kim, J. H. J. Korean Phys. Soc. 2009, 54, 1330
13. Norman, J. A. T.; Perez, M.; Lei, X.; Cheng, H. ECS Trans. 2007, 3 (15, Atomic Layer Deposition Applications 2) 161
14. Li, Z.; Barry, S. T.; Gordon, R. G. Inorg. Chem. 2005, 44, 1728
15. Toerndahl, T.; Ottosson, M.; Carlsson, J. Thin Solid Films 2004, 458, 129
16. Solanki, R.; Pathangey, B. Electrochem. Solid State 2000, 3, 479
17. Papadimitropoulos, G.; Davazoglou, D. J. Nanosci. Nanotechnol. 2011, 11, 8237
18. Turgambaeva, A.; Prud'homme, N.; Krisyuk, V.; Vahlas, C. J. Nanosci. Nanotechnol. 2011, 11, 8198
19. Papadimitropoulos, G.; Davazoglou, D. J. Nanosci. Nanotechnol. 2011, 11, 8169
20. Kang, S.; Shin, Y.; Kim, J.; Yun, J.; Chang, Y.; Yang, I. Chem. Vapor Deposition 2011, 17, 65
21. Piszczek, P.; Szymanska, I.; Bala, W.; Bartkiewicz, K.; Talik, E.; Heiman, J. Thin Solid Films 2008, 516, 3924
22. Kang, S.-W.; Seong, D. J.; Yun, J. Y.; Rhee, S. W. Electrochem. Solid-State Lett. 2006, 9, C161
23. Choi, K.-K.; Rhee, S. Thin Solid Films 2001, 397, 70
24. Chen, T.-Y.; Vaissermann, J.; Ruiz, E.; Senateur, J. P.; Doppelt, P. Chem. Mater. 2001, 13, 3993
25. Doppelt, P. Coord. Chem. Rev. 1998, 178-180, 1785
26. Thompson, J. S.; Zhang, L; Wyre, J. P.; Brill, D.; Lloyd, K. G. Thin Solid Films 2009, 517, 2845
27. Park, K.-H.; Bradley, A. Z.; Thompson, J. S.; Marshall, W. J. Inorg. Chem. 2006, 45, 8480
28. McGeachin, S. G. Can. J. Chem. 1968, 46, 1903
29. Thompson, J. S.; Bradley, A. Z.; Park, K.-H.; Dobbs, K. D.; Marshall, W. Organometallics 2006, 25, 2712
30. Martell, A. E.; Smith, R. M. Critical Stability Constants; Plenum Press: New York, 1974; Vol 2.
31. Yagil, G. Tetrahedron 1967, 23, 2855
32. Seitz, O.; Dai, M.; Aguirre-Tostado, F. S.; Wallace, R. M.; Chabal, Y. J. J. Am. Chem. Soc. 2009, 131, 18159
33. Liu, X.; Wang, Q.; Chen, L. Appl. Surf. Sci. 2009, 255, 3789
34. Senkevich, J. J.; Yang, G. R.; Tang, F.; Wang, G. C.; Lu, T. M.; Cale, T. S.; Jezewski, C.; Lanford, W. A. Appl. Phys. A: Mater. 2004, 79, 1789
35. Bae, D.-L.; Senkevich, J. J.; Jezewski, C.; Kwon, Y.; Cale, T. S. Proc.-Electrochem. Soc. 2003, 2003-13 (Thin Film Materials, Processes, and Reliability) 59
36. Blajiev, O. L.; Breugelmans, T.; Pintelon, R.; Hubin, A. Electrochim. Acta 2006, 51, 1403
37. Kellock, A. J.; Tabacniks, M. H.; Baglin, J. E. E.; Somcio, N. S.; Bardin, T. T.; Miller, D. C. Nucl. Instrum. Methods 1997, 127/128, 742
38. Jimenez, P.; Roux, M. V.; Turrion, C.; Gomis, F. J. Chem. Thermodyn. 1987, 19, 985
39. De Wit, H. G. M.; Van Miltenburg, J. C.; De Fruif, C. G. J. Chem. Thermodyn. 1983, 15, 651
40. Blajiev, O. L.; Breugelmans, T.; Pintelon, R.; Hubin, A. Electrochim. Acta 2006, 51, 1403
41. Cardini, G.; Muniz-Miranda, M. J. Phys. Chem. B 2002, 106, 6875
42. Wadsworth, M. E.; Zhu, X.; Thompson, J. S.; Pereira, C. J. Hydrometallurgy 2000, 57, 1
43. Muniz-Miranda, M.; Neto, N.; Sbrana, G. J. Mol. Struct. 1999, 482-483, 207
44. Matero, R.; Rahtu, A.; Ritala, M.; Leskelä, M.; Sajavaara, T. Thin Solid Films 2000, 368, 1
45. Sung, M. M.; Sung, K.; Kim, C. G.; Lee, S. S.; Kim, Y. J. Phys. Chem. B 2000, 104, 2273
46. Casella, I. G.; Gatta, M. J. Electroanal. Chem. 2000, 494, 12
47. Galtayries, A.; Bonnelle, J.-P. Surfac. Interf. Anal. 1995, 23, 171
48. Chawla, S. K.; Sankarraman, N.; Payer, J. H. J. Electron. Spec. Relat. Phenom. 1992, 61, 1
49. Deroubaix, G.; Marcus, P. Surf. Interface Anal. 1992, 18, 39
50. Wagner, C. D.; Joshi, A. J. Electron. Spec. Relat. Phenom. 1988, 47, 283
51. Wagner, C. D.; Gale, L. H.; Raymond, R. H. Anal. Chem. 1979, 51, 466
52. Wagner, C. D.; Naumkin, A. V.; Kraut-Vass, A.; Allsion, J. W.; Powell, C. J.; Rumble, J. R., NIST Standard Reference Database 20, Version 3.4 (Web Version); http://srdata.nist.gov/xps.
53. Katrib, A.; El-Rayyes, N. R.; Al-Kharafi, F. M. J. Electron. Spec. Relat. Phenom. 1983, 31, 317
54. Clark, D. T.; Liley, D. M. J. Chem. Phys. Lett. 1971, 9, 234
55. Thompson, J. S. U.S. Patent 7,604,840, October 20, 2009.
56. Thompson, J. S. U.S. Patent 7,632,351, December 15, 2009.
57. Thompson, J. S.; Radzewich, C. E. U.S. Patent 7,736,697, June 15, 2010.
58. Thompson, J. S. U.S. Patent 7,776,394, August 17, 2010.