Atomic layer deposition of copper seed layers from a (hfac)Cu(VTMOS) precursor

Journal of the Korean Physical Society

Volumn 54, Issue 3, 2009, Pages 1330-1333

  Moon, Dae Yong ^a   Kim, Woong Sung ^a   Kim, Tae Sub ^a   Kang, Byung Woo ^a   Park, Jong Wan ^a   Yeom, Seun Jin ^b   Kim, Jae Hong ^b  

^a Hanyang University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

ALD; Copper; Interconnection; Seed layer; Thin film

Indexed keywords

EID: 64549130928     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.54.1330     Document Type: Article

References (15)

1. S. P. Murarka, Mater. Sci. Eng. R 19, 87 (1997).
2. T. Homma, Thin Solid Films 278, 28 (1996).
3. M. T. Bohr, Solid State Technology 39, 105 (1996).
4. W. H. Lee, B. S. Seo, I. J. Byun, Y. G. Ko, J. Y. Kim and J. G. Lee, J. Korean Phys. Soc. 40, 107 (2002).
5. C. M. Lee and S. H. Han, J. Korean Phys. Soc. 28, 490 (1995).
6. S. I. Kim, S. Y. Kim, D. H. Lee, G. B. Kang and C. W. Lee, J. Korean Phys. Soc. 50, 650 (2007).
7. B. N. Park, S. C. Bae, S. H. Son, J. H. Lee, C.G. Suk, J. K. Choi and S. Y. Choi, J. Korean Phys. Soc. 38, 232 (2001).
8. G. Oksam, P. M. Vereecken and P. C. Searson, J. Electrochem. Soc. 146, 1436 (1999).
9. Q.-T. Jiang, M. E. Thomas, G. Bersuker, B. Foran, R. Mikkola, B. Carpenter and J. Ormando, Mat. Res. Soc. Symp. Proc. 564, 429 (1999).
10. C. L. Lin, P. S. Chen and M. C. Chen, J. Elect. Soc. 149, C237 (2002).
11. D. K. Kwak, H. B. Lee, J. W. Han and S. W. Kang, Electrochem. Solid-State Lett. 9, C171 (2006).
12. T. Y. Chang, J. J. Tze and D. S. Tsai, Appl. Surf. Sci. 236, 165 (2004).
13. A. U. Mane and S. A. Shivashankar, J. Cryst. Growth. 275, e1253 (2005).
14. K. Lee, K. Kim and H. Jeon, J. Korean Phys. Soc. 50, 1141 (2007).
15. M. Xu, H. Tiznado, B.-C. Kang, M. Bouman, I. Lee and F. Zaera, J. Korean Phys. Soc. 51, 1063 (2007).