In situ functionalized self-assembled monolayer surfaces for selective chemical vapor deposition of copper

Applied Surface Science

Volumn 255, Issue 6, 2009, Pages 3789-3794

  Liu, Xin ^a   Wang, Qi ^b   Chen, Liu Ping ^a  

^a SUN YAT SEN UNIVERSITY   (China)

^b ZHEJIANG UNIVERSITY   (China)

Author keywords

Copper thin film; In situ functionalization; Selective chemical vapor deposition; Self assembled monolayer

Indexed keywords

METALLIC FILMS; SELF ASSEMBLED MONOLAYERS; THIN FILMS;

CHEMICAL TRANSFORMATIONS; CHEMICAL VAPOR DEPOSITIONS (CVD); COPPER DEPOSITION; COPPER METALLIZATION; COPPER THIN FILM; FUNCTIONALIZATIONS; SELECTIVE DEPOSITION; UV-LIGHT IRRADIATION;

CHEMICAL VAPOR DEPOSITION;

EID: 57849091008     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.10.051     Document Type: Article

References (33)

1. In: Kodas T.T., and Hampden-Smith M.J. (Eds). The Chemistry of Metal CVD (1994), VCH, Weinheim, Germany (Chapter 4, 5)
2. Alford T.L., Li J., Mayer J.W., and Wang S.Q. Thin Solid Films 262 (1995) vii
3. Ekerdt J.G., Sun Y.M., Szabo A., Szulczewski G.J., and White J.M. Chem. Rev. 96 (1996) 1499
4. Jain A., Kodas T.T., Jairath R., and Hampden-Smith M.J. J. Vac. Sci. Technol. B 11 (1993) 2107
5. Potochnik S.J., Pehrsson P.E., Hsu D.S.Y., and Calvert J.M. Langmuir 11 (1995) 1841
6. Kim S., Park J.M., and Choi D.J. Thin Solid Films 320 (1998) 95
7. Kim D.-H., Wentorf R.H., and Gill W.N. J. Vac. Sci. Technol. A 12 (1994) 153
8. Cohen S.L., Liehr M., and Kasi S. Appl. Phys. Lett. 60 (1992) 50
9. Ulman A. Chem. Rev. 96 (1996) 1533
10. Kumar A., and Whitesides G.M. Science 263 (1994) 60
11. Jeon N.L., Nuzzo R.G., Xia Y.-N., Mrksich M., and Whitesides G.M. Langmuir 11 (1995) 3024
12. Chang W., Choi M., Kim J., Cho S., and Whang K. Appl. Surf. Sci. 240 (2005) 296
13. Vondrak T., Wang H., Winget P., Cramer C.J., and Zhu X.-Y. J. Am. Chem. Soc. 122 (2000) 4700
14. Fan F.-R.F., Yao Y., Cai L., Cheng L., Tour J.M., and Bard A.J. J. Am. Chem. Soc. 126 (2004) 4035
15. Zhou C.-Z., Nagy G., and Walker A.V. J. Am. Chem. Soc. 127 (2005) 12160
16. Sawada S., Masuda Y., Zhu P., and Koumoto K. Langmuir 22 (2006) 332
17. Liu X., Wang Q., Wu S., and Liu Z.-Z. J. Electrochem. Soc. 153 (2006) C142
18. Liu X., Wang Q., and Wu S. Chem. Vap. Deposit. 12 (2006) 679
19. Ramanath G., Cui G., Ganesan P.G., Guo X., Ellis A.V., Stukowski M., Vijayamohanan K., Doppelt P., and Lane M. Appl. Phys. Lett. 83 (2003) 383
20. Doppelt P., Semaltianos N., Cavellin C.D., Pastol J.L., and Ballutaud D. Microelectr. Eng. 76 (2004) 113
21. Kern W.W., and Puotinen D.D.A. RCA Rev. 31 (1970) 187
22. Huang X.-H., Huang H.-Z., Wu N.-Z., Hu R.-S., Zhu T., and Liu Z.-F. Surf. Sci. 459 (2000) 183
23. Drabowicz J., and Mikolajczyk M. Synthesis 1 (1980) 32
24. Xiao Z.-D., Gu J.-H., Huang D., Lu Z.-H., and Wei Y. Appl. Surf. Sci. 125 (1998) 85
25. Balachander N., and Sukenik C.N. Langmuir 6 (1990) 1621
26. Senkevich J.J., Yang G.-R., and Lu T.-M. Colloids Surf. A: Physicochem. Eng. Asp. 207 (2002) 139
27. Parikh A.N., Allara D.L., Azouz I.B., and Rondelez F. J. Phys. Chem. 98 (1994) 7577
28. Vandenberg E.T., Bertilsson L., Liedberg B., Uvdal K., Erlandsson R., Elwing H., and LundstrÖm I. J. Colloid Interface Sci. 147 (1991) 103
29. Senkevich J.J., Mitchell C.J., Yang G.-R., and Lu T.-M. Colloids Surf. A: Physicochem. Eng. Asp. 221 (2003) 29
30. Tillman N., Ulaman A., and Elman J.F. Langmuir 5 (1989) 1020
31. Bain C.D., Troughton E.B., Tao Y.-T., Evall J., Whitesides G.M., and Nuzzo R.G. J. Am. Chem. Soc. 111 (1989) 321
32. Hong L., Sugimura H., Furukawa T., and Takai O. Langmuir 19 (2003) 1966
33. Shirahata N., Yonezawa T., Seo W.-S., and Koumoto K. Langmuir 20 (2004) 1517