Investigation of thermal and hot-wire chemical vapor deposition copper thin films on TiN substrates using cupraselect® as precursor

Journal of Nanoscience and Nanotechnology

Volumn 11, Issue 9, 2011, Pages 8169-8173

  Papadimitropoulos, G ^a   Davazoglou, D ^a  

^a INSTITUTE OF MICROELECTRONICS   (Greece)

Author keywords

Copper; CupraSelect ; Direct liquid injection; Hot wire CVD

Indexed keywords

CARRIER GAS; CHEMICAL VAPOR DEPOSITION REACTORS; COPPER FILMS; COPPER THIN FILM; CU FILMS; DIFFRACTOGRAMS; DIRECT-LIQUID-INJECTION; FILAMENT TEMPERATURE; HOT WIRE CHEMICAL VAPOR DEPOSITION; HOT WIRE CVD; ROOM TEMPERATURE; SEM MICROGRAPHS; SI SUBSTRATES; TUNGSTEN FILAMENTS; XRD;

CHEMICAL VAPOR DEPOSITION; DIRECT INJECTION; LIQUIDS; METALLIC FILMS; TINNING; TITANIUM NITRIDE; TUNGSTEN; TUNGSTEN COMPOUNDS; WIRE;

COPPER;

EID: 84856945804     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2011.5055     Document Type: Conference Paper

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