New precursors for the Atomic Layer Deposition of copper

ECS Transactions

Volumn 3, Issue 15, 2006, Pages 161-170

  Norman, John A T ^a   Perez, Melanie ^a   Lei, Xinjian ^a   Cheng, Hansong ^b  

^a Air Products and Chemicals   (United States)

^b AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMS; CHEMICAL STABILITY; COPPER; METALLIC FILMS; RUTHENIUM;

COPPER FILMS; COPPER PRECURSORS; ELECTRICAL PERFORMANCE; LOW MELTING; MOLECULAR HYDROGEN; PURE COPPER; TEMPERATURE RANGE;

ATOMIC LAYER DEPOSITION;

EID: 45749112554     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2721485     Document Type: Conference Paper

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